Senior Packaging Process Engineer

Company Description

Do you relish the challenge of being part of a growing business, a team, an industry, and seeing the energy you help generate? Are you at your best when contributing to a range of projects and collaborating across teams to help inform, direct and support those around you in solving the problems of the future?

Within CSA Catapult, we look beyond the status quo. We seek to employ people based on ability and attitude; we measure what you deliver and how you do it. We encourage collaboration in everything we do as we value the diversity of thought that we each bring to every challenge.

Who are we? The next wave of emerging technologies will have an enormous impact on our lives. 5G communications will enable a host of new and exciting applications such as connected autonomous vehicles and multimedia services. The challenge of net-zero to have clean, renewable energy and move from the internal combustion engine to electric cars. Compound semiconductor (CS) technologies will underpin many of these developments.

We are a Not-for-Profit organisation; here to help the UK economy grow, and we work across the UK with a range of industry sectors from automotive to medical, and from digital communications to aerospace. Through employing leading minds and investing in technology, we help turn ideas into reality, bridging the gap between concept and implementation.

CSA Catapult is committed to supporting and upholding diversity, equality, and inclusion in everything we do. A commitment to embrace and advocate for inclusion is an essential part of all roles.

Position

CSA Catapult requires a Senior Packaging Process Engineer to work in a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies with a strong background in 3D and 2.5D integration, high-speed interconnects, and advanced semiconductor packaging. This role is pivotal in driving the development of cutting-edge packaging solutions for next-generation systems in AI, co-packaged RF and photonics systems.

The Senior Packaging Process Engineer shall be a subject matter expert/ specialist leading a project team of multidisciplinary engineers to deliver complex integration projects, enabling heterogeneous system-in-package (SiP) platforms and performance-optimized device architectures.

The Senior Engineer is expected to have expert knowledge in microelectronics assembly and validation, and broad knowledge of semiconductor package engineering, science and technology with prior experience. They will be applying their knowledge to solve the semiconductor assembly and bonding challenges in advanced packaging of CS products using a wide range of bonding materials. They will support planning projects, bid preparation, technical proposals and quotations, working closely with the bid team and commercial team.

Key responsibilities include:

• Lead development of advanced packaging assembly processes, focusing on 3D/2.5D integration, high-density interposers, and high-speed interconnect solutions (e.g., micro-bumps, hybrid bonding, through-silicon vias)
• Design and validate high-speed interconnect solutions as part of heterogeneous integration and system-in-package (SiP) platforms
• Define and validate interconnect schemes (fine-pitch flip chip, wafer-level packaging, hybrid bonding) to meet electrical, thermal, and mechanical performance targets
• Develop robust assembly process flows, including die attach, underfill, bonding, and encapsulation for 3D stacked and interposer-based packages
• Lead design-for-manufacturing (DFM) activities in collaboration with internal and external design and product development teams
• Drive technical DOEs, reliability testing, failure analysis, and statistical process control for advanced packaging
• Interface with technology partners, equipment vendors, and customers to evaluate and implement state-of-the-art materials and tools (e.g., low-loss dielectrics, ultra-fine-pitch interconnects)
• Lead lab-based activities including equipment setup, process characterization, prototyping, and DOEs using tools such as die bonders, sinter presses, wire bonders, and plasma cleaners
• Lead project teams, contribute to bid proposals, technical plans, and funding applications
• Act as a technical authority across multiple packaging projects, mentoring junior engineers and collaborating with cross-functional teams
• support the preparation of technical documentation, including work instructions, process flow diagrams, and qualification reports
• Interface with commercial, R&D, and customer teams to ensure alignment of assembly processes with program goals
• Contribute to the development of scale-up plans and futureproofing strategies for process industrialization and facility readiness
• Contribute to the strategic roadmap for CSA Catapult’s advanced packaging capability
• Present results and work to wide audiences to enhance the reputation of the Catapult

Requirements

• Deep expertise in advanced microelectronics assembly process, with hands-on experience in 2.5D/ 3D integration, hybrid bonding, flip chip, and SiP
• Strong background in semiconductor packaging processes such as die stacking, hybrid bonding, TSV, RDL, and wafer-level packaging
• Proven track record of leading packaging R&D projects, including prototype development and validation of high-speed digital and analogue hardware
• Knowledge of electrical and thermal modelling, material behaviour at high frequency, and system-level integration
• Familiarity with cleanroom protocols, lab tools, and statistical process control (SPC) methodologies
• Experience supporting equipment procurement, installation, and process development in an R&D or pilot line environment
• Excellent verbal and written communication skills in English
• Excellent team working skills with the proven ability to work collaboratively and cooperatively with colleagues
• Analytical and problem-solving skills, including the ability to quickly understand complex issues and to propose solutions

Other information

• Up to £63,960 salary (FTE)
• A non-contractual bonus scheme to allow everyone to share in our success
• Life Assurance – 4 times your annual salary
• Scottish Widows pension scheme – you put in 5% and we’ll put in 10%
• 28 days leave in addition to 8 bank holidays
• 37.5 hour full time working week
• A generous private medical insurance scheme for you and your family (enrolment once a year)
• A cashback scheme for your eye tests and dental treatment
• Payment for a professional membership each year
• Holiday purchase scheme (enrolment once a year)
• Flexible working – we operate core hours of 10-4. The balance of your hours can be worked around what works for you
• Electric Vehicle and Cycle to work schemes