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Staff Process Integration Engineer (Chip, R&D, NPI, Wafer Fab – Semiconductor)
Lumentum is seeking a highly skilled Process Integration Engineer to join our Chip R&D team. This position involves developing and managing wafer fabrication processes for indium phosphide (InP)-based semiconductor optical components. The role is based at our Caswell facility and plays a key part in advancing next-generation photonic technologies for cloud and networking applications
Role Overview
As a Process Integration Engineer, you will be instrumental in translating advanced photonic device designs into manufacturable, high-performance semiconductor chips. Working closely with multidisciplinary engineering teams, your focus will be on integrating new processes, refining existing ones, and enabling volume production of innovative optical components including lasers, modulators, receivers, and photonic integrated circuits (PICs)
.Key Responsibilities
- Develop and integrate process flows for new InP-based photonic devices, including coherent and direct detection components
- Optimize existing wafer fab processes to enhance yield, reduce cost, and shorten cycle times
- Define and document process flows and procedures using the wafer fab MES system
- Track the progress and performance of new products through the fab during the development cycle
- Use analytical tools (e.g., SEM) to understand and refine fabrication processes
- Create and validate new process modules for novel device architectures, ensuring volume manufacturability
- Lead the transfer of new process technologies and devices from R&D into volume production
- Apply Six Sigma methodologies (e.g., FMEA, capability analysis) to document and improve processes
- Present data and findings to demonstrate manufacturability using statistical analysis
- Act as the liaison between the device design team and manufacturing/operations teams
- Provide ongoing technical expertise and support for products even after production transfer
Qualifications & Experience
Essential
- Degree (PhD preferred) in Physics, Physical Chemistry, Materials Science, or a related discipline. Equivalent industry experience will also be considered
- Strong hands-on experience in semiconductor wafer processing, ideally with III-V materials. Familiarity with several of the following is required: epitaxy, lithography, wet/dry etching, dielectric/metal deposition, implant, diffusion
- Proven experience in developing complete device process flows and integrating new and existing fab processes
- Familiarity with direct bandgap semiconductors is a plus
- Demonstrated ability to manage and execute complex engineering projects
- Industrial experience in a wafer fabrication environment is desirable
.Skills & Competencies
- Strong analytical and problem-solving skills, with the ability to apply scientific reasoning across various technical challenges
- Proficiency in statistical analysis methods (e.g., using JMP or similar tools)
- Excellent organizational, communication, and collaboration skills
- Demonstrated technical leadership in a cross-functional team environment
- Effective communicator in both verbal and written formats
- Willingness to travel internationally to collaborate with global engineering teams
- Must have the legal right to work in the UK
