The role in the mechanical simulation team will entail combining simulation with experimental measurements to analyse different semiconductor packages. The successful applicant will primarily work on developing new modelling techniques and helping to evaluate their efficacy for future applications. Potential research topics may include, homogenised material property application in Finite element analysis (FEA), transient thermal response of a system in package (SIP), parameterised stress analysis of package structures.
FEA and thermal computational fluid dynamics (CFD) are performed using ANSYS commercial tools, augmented by Python and Excel for experimental data signal filtering and post processing. Code development in Python will be part of the role.
The role provides an opportunity to collaborate with engineers across multi-disciplinary teams, including mechanical designers, measurement analysts, and electrical systems engineers. The ideal candidate will have an analytical mindset with the confidence to take on challenging numerical tasks independently, as well as an inquisitive nature for open collaboration with other team members.
Your Skills & Experiences
- Working towards a Master’s degree in Mechanical Engineering.
- Ideally some experience in FEA, alternatively experience in using matrix methods for structural analysis.
- Candidate will have completed courses in; Solid mechanics with competence in analytical solutions, thermodynamics with good understanding of Fourier’s law of heat conduction, and material science of dielectrics (ceramics), metals, polymers.
- Proven experience in using Python or MatLab.
- CAD modelling experience ideal (any package).
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