Principal Packaging Engineer

The Company

CSA Catapult is the UK’s authority on compound semiconductor applications and commercialisation. We work with start-ups, SMEs, large organisations, and academia to de-risk innovation, remove barriers to market, and accelerate the adoption of compound semiconductor technologies.

If you thrive in a growing organisation, enjoy contributing to diverse projects, and value cross-team collaboration, you’ll fit right in. Our work supports the technologies shaping the future from AI hardware and infrastructure, electric vehicles and satellite communications to remote health monitoring and net zero— compound semiconductor applications offer unrivalled power to help us thrive, connect, and explore.

As a Not‑for‑Profit organisation, we exist to drive UK economic growth. We work across sectors including automotive, medical, digital communications, and aerospace. By bringing together leading expertise and investing in cutting‑edge technology, we bridge the gap between industry and academia to help commercialise innovation and deliver national impact.

We look beyond the status quo and hire for ability and attitude. We value collaboration, innovation and trust and we measure outcomes, and champion diverse perspectives. Diversity, equality, and inclusion are central to who we are, and every role plays a part in upholding these commitments.

Position

CSA Catapult is seeking a Principal semiconductor Packaging Engineer to lead and architect cutting-edge 3D and 2.5D semiconductor packaging technologies, including advanced interconnects, system-in-package (SiP), chiplet integration, and high-bandwidth interface packaging. This is a strategic technical role combining deep packaging expertise with systems-level design thinking to define and deliver next-generation packaging platforms.

As a senior technical authority, you will lead internal and collaborative R&D programs and interface with global industry and academic partners to deliver packaging solutions for heterogeneous integration, targeting applications in AI, HPC, power electronics, RF, and photonics. You will provide design expertise on the project, analysis, assembly and technical guidance on test and validation activities and will be expected to participate in these activities in the labs at Catapult’s Innovation Centre.

This position drives all packaging aspects of prototype/ product development by charting and enabling packaging technology roadmaps in collaboration with internal and external stakeholders.

Key tasks include:

• Architect and deliver cutting-edge packaging solutions for heterogeneous integration
• Serve as a solution architect for 3D and 2.5D packaging platforms, resolving system-level packaging challenges from concept design through to prototype and demonstrator builds
• Lead the definition, design, and development of advanced packaging solutions incorporating substrates, interposers, chiplets, high-density interconnects, microbump /UCIe interfaces, TSVs, and hybrid bonding for various applications including automotive, telecom and photonics
• As a solution architect, resolve complex semiconductor packaging challenges starting from customer requirement analysis to package design, assembly and validation
• Support the planning and development of technical strategies and roadmap in line with the Catapult’s themes and technological interests
• Lead multiple projects simultaneously, working closely with the Project Manager to meet system requirements and customer needs
• Lead and coordinate technical work packages, interacting with packaging design, substrate, assembly, and thermal teams
• Engage in hands-on prototyping and lab-level validation where needed, using CSA’s Innovation Centre capabilities
• Design and develop various advanced microelectronics modules/ systems and demonstrators using a combination of technologies
• Provide technical guidance on design, assembly, test, and validation activities with an occasional need to participate in these activities in the labs at CSA Catapult’s Innovation Centre
• Technical reporting to the project team and a wider audience to demonstrate regular progress
• Consult with the Business Development team and customers to identify collaborative opportunities

Requirements

About you; you will have:

• Demonstrable experience in advanced semiconductor package design, assembly, and packaging development including 3D/2.5D integration, chiplet-based architecture, and heterogeneous systems
• Demonstrable experience in leading microelectronics packaging projects, and work packages, ideally across a multitude of different markets
• Strong understanding of the semiconductor packaging lifecycle, from design and modelling to process validation and qualification
• Familiarity with signal integrity, power integrity, and thermal management design principles for densely integrated packages
• Excellent verbal and written communication skills in English
• Strong communication and leadership skills; able to mentor others, build cross-functional consensus, and represent technical positions to partners and stakeholders
• Industry-proven analytical and problem-solving skills, including the ability to quickly understand complex issues and to propose solutions
• A module and systems engineering approach to projects
• A history of translating research into working demonstrators, including documentation, testing, and customer reporting

Other information

• Salary up to £76,858
• A non-contractual bonus scheme to allow everyone to share in our success
• Life Assurance – 4 times your annual salary
• Scottish Widows pension scheme – you put in 5% and we’ll put in 10%
• 28 days leave in addition to 8 bank holidays
• 37.5 hour full time working week
• A generous private medical insurance scheme for you and your family (enrolment once a year)
• A cashback scheme for your eye tests and dental treatment
• Payment for a professional membership each year
• Holiday purchase scheme (enrolment once a year)
• Flexible working – we operate core hours of 10-4. The balance of your hours can be worked around what works for you
• Electric Vehicle and Cycle to work schemes