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Company Description
CSA Catapult is the UK’s authority on compound semiconductor applications and commercialisation. We work with start-ups, SMEs, large organisations, and academia to de-risk innovation, remove barriers to market, and accelerate the adoption of compound semiconductor technologies.
If you thrive in a growing organisation, enjoy contributing to diverse projects, and value cross-team collaboration, you’ll fit right in. Our work supports the technologies shaping the future from AI hardware and infrastructure, electric vehicles and satellite communications to remote health monitoring and net zero— compound semiconductor applications offer unrivalled power to help us thrive, connect, and explore.
As a Not‑for‑Profit organisation, we exist to drive UK economic growth. We work across sectors including automotive, medical, digital communications, and aerospace. By bringing together leading expertise and investing in cutting‑edge technology, we bridge the gap between industry and academia to help commercialise innovation and deliver national impact.
We look beyond the status quo and hire for ability and attitude. We value collaboration, innovation and trust and we measure outcomes, and champion diverse perspectives. Diversity, equality, and inclusion are central to who we are, and every role plays a part in upholding these commitments.
Position
CSA Catapult requires a Senior Packaging Process Engineer to work in a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies with a strong background in 3D and 2.5D integration, high-speed interconnects, and advanced semiconductor packaging. This role is pivotal in driving the development of cutting-edge packaging solutions for next-generation systems in AI, co-packaged RF and photonics systems.
The Senior Packaging Process Engineer shall be a subject matter expert/ specialist leading a project
The Senior Engineer is expected to have expert knowledge in microelectronics assembly and validation, and broad knowledge of semiconductor package engineering, science and technology with prior experience. They will be applying their knowledge to solve the semiconductor assembly and bonding challenges in advanced packaging of CS products using a wide range of bonding materials. They will support planning projects, bid preparation, technical proposals and quotations, working closely with the bid team and commercial team.
Key responsibilities include:
Requirements
Other information