Senior Process Engineer

Company Description

CSA Catapult is the UK’s authority on compound semiconductor applications and commercialisation. We work with start-ups, SMEs, large organisations, and academia to de-risk innovation, remove barriers to market, and accelerate the adoption of compound semiconductor technologies.

If you thrive in a growing organisation, enjoy contributing to diverse projects, and value cross-team collaboration, you’ll fit right in. Our work supports the technologies shaping the future from AI hardware and infrastructure, electric vehicles and satellite communications to remote health monitoring and net zero— compound semiconductor applications offer unrivalled power to help us thrive, connect, and explore.

As a Not‑for‑Profit organisation, we exist to drive UK economic growth. We work across sectors including automotive, medical, digital communications, and aerospace. By bringing together leading expertise and investing in cutting‑edge technology, we bridge the gap between industry and academia to help commercialise innovation and deliver national impact.

We look beyond the status quo and hire for ability and attitude. We value collaboration, innovation and trust and we measure outcomes, and champion diverse perspectives. Diversity, equality, and inclusion are central to who we are, and every role plays a part in upholding these commitments.

Position

CSA Catapult requires a Senior Packaging Process Engineer to work in a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies with a strong background in 3D and 2.5D integration, high-speed interconnects, and advanced semiconductor packaging. This role is pivotal in driving the development of cutting-edge packaging solutions for next-generation systems in AI, co-packaged RF and photonics systems.

The Senior Packaging Process Engineer shall be a subject matter expert/ specialist leading a project

The Senior Engineer is expected to have expert knowledge in microelectronics assembly and validation, and broad knowledge of semiconductor package engineering, science and technology with prior experience. They will be applying their knowledge to solve the semiconductor assembly and bonding challenges in advanced packaging of CS products using a wide range of bonding materials. They will support planning projects, bid preparation, technical proposals and quotations, working closely with the bid team and commercial team.

Key responsibilities include:

• Lead development of advanced packaging assembly processes, focusing on 3D/2.5D integration, high-density interposers, and high-speed interconnect solutions (e.g., micro-bumps, hybrid bonding, through-silicon vias)
• Design and validate high-speed interconnect solutions as part of heterogeneous integration and system-in-package (SiP) platforms
• Define and validate interconnect schemes (fine-pitch flip chip, wafer-level packaging, hybrid bonding) to meet electrical, thermal, and mechanical performance targets
• Develop robust assembly process flows, including die attach, underfill, bonding, and encapsulation for 3D stacked and interposer-based packages
• Lead design-for-manufacturing (DFM) activities in collaboration with internal and external design and product development teams
• Drive technical DOEs, reliability testing, failure analysis, and statistical process control for advanced packaging
• Interface with technology partners, equipment vendors, and customers to evaluate and implement state-of-the-art materials and tools (e.g., low-loss dielectrics, ultra-fine-pitch interconnects)
• Lead lab-based activities including equipment setup, process characterization, prototyping, and DOEs using tools such as die bonders, sinter presses, wire bonders, and plasma cleaners

Requirements

• Deep expertise in advanced microelectronics assembly process, with hands-on experience in 2.5D/ 3D integration, hybrid bonding, flip chip, and SiP
• Strong background in semiconductor packaging processes such as die stacking, hybrid bonding, TSV, RDL, and wafer-level packaging
• Proven track record of leading packaging R&D projects, including prototype development and validation of high-speed digital and analogue hardware
• Knowledge of electrical and thermal modelling, material behaviour at high frequency, and system-level integration
• Familiarity with cleanroom protocols, lab tools, and statistical process control (SPC) methodologies
• Experience supporting equipment procurement, installation, and process development in an R&D or pilot line environment
• Excellent verbal and written communication skills in English
• Excellent team working skills with the proven ability to work collaboratively and cooperatively with colleagues
• Analytical and problem-solving skills, including the ability to quickly understand complex issues and to propose solutions

Other information

• Up to £65,878 salary (FTE)
• A non-contractual bonus scheme to allow everyone to share in our success
• Life Assurance – 4 times your annual salary
• Scottish Widows pension scheme – you put in 5% and we’ll put in 10%
• 28 days leave in addition to 8 bank holidays
• 37.5 hour full time working week
• A generous private medical insurance scheme for you and your family (enrolment once a year)
• A cashback scheme for your eye tests and dental treatment
• Payment for a professional membership each year
• Holiday purchase scheme (enrolment once a year)
• Flexible working – we operate core hours of 10-4. The balance of your hours can be worked around what works for you.
• Electric Vehicle and Cycle to work schemes